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never stop thinking. hys72d32300[g/h]br?[5/6/7]?c hys72d64300[g/h]br?[5/6/7]?c hys72d64320[g/h]br?[5/6]?c hys72d128320[g/h]br?[6/7]?c 184-pin registered double data rate sdram module reg dimm ddr sdram data sheet, rev. 1.2, oct. 2004 memory products
edition 2004-10 published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen, germany ? infineon technologies ag 2004. all rights reserved. attention please! the information herein is given to describe certain co mponents and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology , delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain da ngerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safe ty or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body, or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
never stop thinking. hys72d32300[g/h]br?[5/6/7]?c hys72d64300[g/h]br?[5/6/7]?c hys72d64320[g/h]br?[5/6]?c hys72d128320[g/h]br?[6/7]?c 184-pin registered double data rate sdram module reg dimm ddr sdram data sheet, rev. 1.2, oct. 2004 memory products
template: mp_a4_v2.2_2003-10-07.fm hys72d32300[g/h]br?[5/6/7]?c, hys72d64300[g/ h]br?[5/6/7]?c, hys72d64320[g/h]br?[5/6]?c, hys72d128320[g/h]br?[6/7]?c revision history: rev. 1.2 2004-10 previous version: rev. 1.1 2004-03 page subjects (major changes since last revision) 7 added rohs product types 21 , 22 , 23 updated i dd values 32 , 38 , 44 updated spd codes we listen to your comments any information within this do cument that you feel is wro ng, unclear or missing at all? your feedback will help us to continuous ly improve the qualit y of this document. please send your proposal (including a reference to this document) to: techdoc.mp@infineon.com
data sheet 5 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram 1 overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.2 description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3.1 operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4 current specification and conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 5 spd contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 6 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6.1 raw card a . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 6.2 raw card c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.3 raw card b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 6.4 raw card d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 7 application note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 table of contents
184-pin registered double data ra te sdram module reg dimm hys72d32300[g/h]br?[5/6/7]?c hys72d64300[g/h]br?[5/6/7]?c hys72d64320[g/h]br?[5/6]?c hys72d128320[g/h]br?[6/7]?c data sheet 6 rev. 1.2, 2004-10 07302003-2mi6-fop1 1overview 1.1 features ? 184-pin registered 8-byte dual-in-line ddr sdram module for ?1u? pc, workstation and server main memory applications ? one rank 32m 72 and 64m 72 and two ranks 64m 72 and 128m 72 organization ? jedec standard double data rate synchronous drams (ddr sdram) wit h a single + 2.5 v ( 0.2 v) power supply and + 2.6 v ( 0.1 v) power supply for ddr400 ? built with 256-mbit ddr sdra ms in p-tfbga- 60-1 packages ? programmable cas latency, burst length, and wrap sequence (sequential & interleave) ? auto refresh (cbr) and self refresh ? all inputs and outputs sstl_2 compatible ? re-drive for all input signals using register and pll devices. ? serial presence detect with e 2 prom ? low profile modules form factor: 133.35 mm 28.58 mm 4.00 mm / 2.64 mm and for 1gb 133.35 mm 30.48 mm (1.2?) 4.00 mm ? jedec standard reference layout for one rank 256mb, 512mb and two ranks 512mb, 1gb: pc2700 and pc3200 registered dimm raw cards a,b,c,d ? gold plated contacts 1.2 description the hys72d[128/64/32]3xx[g/h]br?[5/6/7]?c and hys 72d64320gbr?5?c are low profile versions of the standard registered dimm modules suitable for 1u se rver applications. the low profile dimm versions are available as 32m 72 (256 mb), 64m 72 (512 mb) and 128m 72 (1 gb) the memory array is designed with double data rate sy nchronous drams for ecc applications. all control and address signals are re-driven on the dimm using register devices and a pll for the clock distribution. this reduces capacitive loading to the system bus, but adds one cycl e to the sdram timing. a variety of decoupling capacitors are mounted on the pc board. the dimms feature serial presence detect based on a serial e 2 prom device using the 2-pin i 2 c protocol. the first 128 bytes are programmed with configuration data and the second 128 bytes are available to the customer. table 1 performance part number speed code -5 ? 6-7 unit speed grade component ddr400b ddr333b ddr266a ? module pc3200-3033 pc2700?2533 pc2100-2033 ? max. clock frequency @cl3 f ck3 200 166 ? mhz @cl2.5 f ck2.5 166 166 143 mhz @cl2 f ck2 133 133 133 mhz
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram overview data sheet 7 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 2 ordering information for lead-containing products product type complianc e code description sdram technology pc3200 (cl = 3.0) hys72d32300gbr?5?c pc3200r?30330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300gbr?5?c pc3200r?30330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d64320gbr?5?c pc3200r?30330?b0 2 ranks 512 mb registered dimm ecc 256 mbit ( 8) pc2700 (cl = 2.5) hys72d32300gbr?6?c pc2700r?25330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300gbr?6?c pc2700r?25330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d64320gbr?6?c pc2700r?25330?b0 2 ranks 512 mb registered dimm ecc 256 mbit ( 8) hys72d128320gbr?6?c pc2700r?25330?d0 2 ranks 1 gb registered dimm ecc 256 mbit ( 4) pc2100 (cl = 2.0) hys72d32300gbr?7?c pc2100r?20330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300gbr?7?c pc2100r?20330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d128320gbr?7?c pc2100r?20330?d0 2 ranks 1 gb registered dimm ecc 256 mbit ( 4) table 3 ordering information for lead-free (rohs 1) compliant) products product type 2) compliance code 3) description sdram technology pc3200 (cl = 3.0) hys72d32300hbr?5?c pc3200r?30330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300hbr?5?c pc3200r?30330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d64320hbr?5?c pc3200r?30330?b0 2 ranks 512 mb registered dimm ecc 256 mbit ( 8) pc2700 (cl = 2.5) hys72d32300hbr?6?c pc2700r?25330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300hbr?6?c pc2700r?25330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d64320hbr?6?c pc2700r?25330?b0 2 ranks 512 mb registered dimm ecc 256 mbit ( 8) hys72d128320hbr?6?c pc2700r?25330?d0 2 ran ks 1 gb registered dimm ecc 256 mbit ( 4) pc2100 (cl = 2.0) hys72d32300hbr?7?c pc2100r?20330?a0 1 rank 256 mb registered dimm ecc 256 mbit ( 8) hys72d64300hbr?7?c pc2100r?20330?c0 1 rank 512 mb registered dimm ecc 256 mbit ( 4) hys72d128320hbr?7?c pc2100r?20330?d0 2 ran ks 1 gb registered dimm ecc 256 mbit ( 4)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram overview data sheet 8 rev. 1.2, 2004-10 07302003-2mi6-fop1 1) rohs compliant product: restriction of the use of certain hazardous substances (rohs) in electrical and electronic equipment as defined in the directive 2002/95/ec issued by the european parliament and of the council of 27 january 2003. these substances include mercury, lead, cadm ium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers. 2) all product types end with a place code designating the s ilicon-die revision. reference information available on request. example: hys72d128300gbr-5-b, indicating rev.b die are used for sdram components. 3) the compliance code is printed on the module labels and de scribes the speed sort (for ex ample ?pc2100r?), the latencies (for example ?20330? means ca s latency of 2.0 clocks, row-column-delay (rcd) latency of 3 clocks and row precharge latency of 3 clocks), jedec spd co de definition version 0, and the raw card used for this module.
data sheet 9 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration 2 pin configuration the pin configuration of the registered ddr sdram dimm is listed by function in table 4 (184 pins). the abbreviations used in columns pin and buffer type are explained in table 5 and table 6 respectively. the pin numbering is depicted in figure 1 . table 4 pin configuration of rdimm pin# name pin type buffer type function clock signals 137 ck0 i sstl clock signal 138 ck0 isstl complement clock 21 cke0 i sstl clock enable rank 0 111 cke1 i sstl clock enable rank 1 note: 2-rank module nc nc sstl note: 1 -rank module control signals 157 s0 isstl chip select of rank 0 158 s1 isstl chip select of rank 1 note: 2-ranks module nc nc ? note: 1-rank module 154 ras isstl row address strobe 65 cas isstl column address strobe 63 we isstl write enable 10 reset ilv- cmos register reset forces registered inputs low note: for detailed description of the power up and power management see the application note at the end of data sheet address signals 59 ba0 i sstl bank address bus 1:0 52 ba1 i sstl 48 a0 i sstl address bus 11:0 43 a1 i sstl 41 a2 i sstl 130 a3 i sstl 37 a4 i sstl 32 a5 i sstl 125 a6 i sstl address bus 11:0 29 a7 i sstl 122 a8 i sstl 27 a9 i sstl 141 a10 i sstl ap i sstl 118 a11 i sstl 115 a12 i sstl address signal 12 note: module based on 256 mbit or larger dies nc nc ? note: 128 mbit based module 167 a13 i sstl address signal 13 note: 1 gbit based module nc nc ? note: module based on 512 mbit or smaller dies data signals 2 dq0 i/o sstl data bus 63:0 4 dq1 i/o sstl 6 dq2 i/o sstl 8 dq3 i/o sstl 94 dq4 i/o sstl 95 dq5 i/o sstl 98 dq6 i/o sstl 99 dq7 i/o sstl 12 dq8 i/o sstl 13 dq9 i/o sstl 19 dq10 i/o sstl 20 dq11 i/o sstl 105 dq12 i/o sstl 106 dq13 i/o sstl 109 dq14 i/o sstl 110 dq15 i/o sstl 23 dq16 i/o sstl 24 dq17 i/o sstl 28 dq18 i/o sstl 31 dq19 i/o sstl table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration data sheet 10 rev. 1.2, 2004-10 114 dq20 i/o sstl data bus 63:0 117 dq21 i/o sstl 121 dq22 i/o sstl 123 dq23 i/o sstl 33 dq24 i/o sstl 35 dq25 i/o sstl 39 dq26 i/o sstl 40 dq27 i/o sstl 126 dq28 i/o sstl 127 dq29 i/o sstl 131 dq30 i/o sstl 133 dq31 i/o sstl 53 dq32 i/o sstl 55 dq33 i/o sstl 57 dq34 i/o sstl 60 dq35 i/o sstl 146 dq36 i/o sstl 147 dq37 i/o sstl 150 dq38 i/o sstl 151 dq39 i/o sstl 61 dq40 i/o sstl 64 dq41 i/o sstl 68 dq42 i/o sstl 69 dq43 i/o sstl 153 dq44 i/o sstl 155 dq45 i/o sstl 161 dq46 i/o sstl 162 dq47 i/o sstl 72 dq48 i/o sstl 73 dq49 i/o sstl 79 dq50 i/o sstl 80 dq51 i/o sstl 165 dq52 i/o sstl 166 dq53 i/o sstl 170 dq54 i/o sstl 171 dq55 i/o sstl 83 dq56 i/o sstl 84 dq57 i/o sstl 87 dq58 i/o sstl 88 dq59 i/o sstl table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function 174 dq60 i/o sstl data bus 63:0 175 dq61 i/o sstl 178 dq62 i/o sstl 179 dq63 i/o sstl 44 cb0 i/o sstl check bits 7:0 45 cb1 i/o sstl 49 cb2 i/o sstl 51 cb3 i/o sstl 134 cb4 i/o sstl 135 cb5 i/o sstl 142 cb6 i/o sstl 144 cb7 i/o sstl 5 dqs0 i/o sstl data strobes 8:0 note: see block diagram for corresponding dq signals 14 dqs1 i/o sstl 25 dqs2 i/o sstl 36 dqs3 i/o sstl 56 dqs4 i/o sstl 67 dqs5 i/o sstl 78 dqs6 i/o sstl data strobes 8:0 86 dqs7 i/o sstl 47 dqs8 i/o sstl 97 dm0 i sstl data mask 0 note: 8 based module dqs9 i/o sstl data strobe 9 note: 4 based module 107 dm1 i sstl data mask 1 note: 8 based module dqs10 i/o sstl data strobe 10 note: 4 based module 119 dm2 i sstl data mask 2 note: 8 based module dqs11 i/o sstl data strobe 11 note: 4 based module 129 dm3 i sstl data mask 3 note: 8 based module dqs12 i/o sstl data strobe 12 note: 4 based module table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function
data sheet 11 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration 149 dm4 i sstl data mask 4 note: 8 based module dqs13 i/o sstl data strobe 13 note: 4 based module 159 dm5 i sstl data mask 5 note: 8 based module dqs14 i/o sstl data strobe 14 note: 4 based module 169 dm6 i sstl data mask 6 note: 8 based module dqs15 i/o sstl data strobe 15 note: 4 based module 177 dm7 i sstl data mask 7 note: 8 based module dqs16 i/o sstl data strobe 16 note: 4 based module 140 dm8 i sstl data mask 8 note: 8 based module dqs17 i/o sstl data strobe 17 note: 4 based module eeprom 92 scl i cmos serial bus clock 91 sda i/o od serial bus data 181 sa0 i cmos slave address select bus 2:0 182 sa1 i cmos 183 sa2 i cmos power supplies 1 v ref ai ? i/o reference voltage 184 v ddspd pwr ? eeprom power supply table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function 15, 22, 30, 54, 62, 77, 96, 104, 112, 128, 136, 143, 156, 164, 172, 180 v ddq pwr ? i/o driver power supply 7, 38, 46, 70, 85, 108, 120, 148, 168 v dd pwr ? power supply 3, 11, 18, 26, 34, 42, 50, 58, 66, 74, 81, 89, 93, 100, 116, 124, 132, 139, 145, 152, 160, 176 v ss gnd ? ground plane table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration data sheet 12 rev. 1.2, 2004-10 other pins 82 v ddid ood v dd identification note: pin in tristate, indicating v dd and v ddq nets connected on pcb 9, 16, 17, 71, 75, 76, 90, 101, 102, 103, 113, 163, 173 nc nc ? not connected pins not connected on infineon rdimm?s table 4 pin configuration of rdimm (cont?d) pin# name pin type buffer type function table 5 abbreviations for pin type abbreviation description i standard input-only pin. digital levels. o output. digital levels. i/o i/o is a bidirectional input/output signal. ai input. analog levels. pwr power gnd ground nu not usable (jedec standard) nc not connected (jedec standard) table 6 abbreviations for buffer type abbreviation description sstl serial stub terminalted logic (sstl2) lv-cmos low voltage cmos cmos cmos levels od open drain. the corresponding pin has 2 operational states, active low and tristate, and allows multiple devices to share as a wire-or.
data sheet 13 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration figure 1 pin configuration 184 pins, reg table 7 address table density organization memory ranks sdrams # of sdrams # of row/rank/ columns bits refresh period interval 256mb 32m 72 1 32 m 8 9 13 / 2 / 10 8 k 64 ms 7.8 s 512mb 64m 72 1 64 m 4 18 13 / 2 / 11 8 k 64 ms 7.8 s 512mb 64m 72 2 32 m 8 18 13 / 2 / 10 8 k 64 ms 7.8 s 1gb 128m 72 2 64 m 4 36 13 / 2 / 11 8 k 64 ms 7.8 s mppd0020 pin 001 pin 003 pin 005 pin 007 pin 009 pin 011 pin 013 pin 015 pin 017 pin 019 pin 021 pin 023 pin 025 pin 027 pin 029 pin 031 pin 033 pin 035 pin 037 pin 039 pin 041 pin 043 pin 045 pin 047 pin 049 pin 051 - - - - - - - - - - pin 002 pin 004 pin 006 pin 008 pin 010 pin 012 pin 014 pin 016 pin 018 pin 020 pin 022 pin 024 pin 026 pin 028 pin 030 pin 032 pin 034 pin 036 pin 038 pin 040 pin 042 pin 044 pin 046 pin 048 pin 050 pin 052 - - - - - - - - - - v ref dqs0 nc dq09 nc dq10 dq00 dq01 dq02 dq03 reset dq08 dqs1 nc dq11 pin 054 pin 056 pin 058 pin 060 pin 062 pin 064 pin 066 pin 068 pin 070 pin 072 pin 074 pin 076 pin 078 pin 080 pin 082 pin 084 pin 086 pin 088 pin 090 pin 092 dq17 dq18 a5 dqs3 dq27 cb00 a0 ba1 - - - - - - - - - - - - - - - - pin 053 pin 055 pin 057 pin 059 pin 061 pin 063 pin 065 pin 067 pin 069 pin 071 pin 073 pin 075 pin 077 pin 079 pin 081 pin 083 pin 085 pin 087 pin 089 pin 091 cke0 dq16 dqs2 a9 a7 dq19 dq24 dq25 a4 dq26 a2 a1 cb01 dqs8 cb02 cb03 - - - - - - - - - - - - - - - - v ss v ss v dd v ss v ddq v ddq v ss v ss v dd v ddq v ss v ddq v ss v dd v ss v dd v ss v ddq v ss v ddq v ss v dd v ss v ddid dq32 dq33 dq34 ba0 dq40 we cas dqs5 dq43 nc dq49 nc dq50 dq56 dq58 sda - - - - - - - - - - - - - - - - - - - - dqs4 dq35 dq41 dq42 dq48 nc dqs6 dq51 dq57 dqs7 dq59 nc scl - - - - - - - - - - - - - - - - - - - - pin 093 pin 095 pin 097 pin 099 pin 101 pin 103 pin 105 pin 107 pin 109 pin 111 - - - - - - - - - - pin 094 pin 096 pin 098 pin 100 pin 102 pin 104 pin 106 pin 108 pin 110 pin 112 - - - - - - - - - - dq05 dq00/dqs9 dq07 nc nc dq15 dm1/dqs10 dq14 cke1/nc nc a12/nc dq21 dm2/dqs11 dq22 dq23 a6 dq29 dm3/dqs12 dq30 dq31 cb5 ck0 a10/ap dq04 dq06 nc dq13 dq15 pin 114 pin 116 pin 118 pin 120 pin 122 pin 124 pin 126 pin 128 pin 130 pin 132 pin 134 pin 136 pin 138 pin 140 pin 142 pin 144 dq20 a11 a8 dq28 a3 dq04 ck0 dm8/dqs17 cb06 cb07 - - - - - - - - - - - - - - - - pin 113 pin 115 pin 117 pin 119 pin 121 pin 123 pin 125 pin 127 pin 129 pin 131 pin 133 pin 135 pin 137 pin 139 pin 141 pin 143 dq37 dm4/dqs13 dq39 dq44 dq45 s0 dm5/dqs14 dq46 nc dq52 a13/nc dm6/dqs15 dq55 nc dq61 dm7/dqs16 dq63 sa0 sa2 - - - - - - - - - - - - - - - - v ddq v ddq v ddq v dd v dd v ss v ss v ss v ss v ddq v ss v ss v ddq v ddq v dd v ddq v ss v ddq v ddq v ss v ddq v ss v dd v ss pin 146 pin 148 pin 150 pin 152 pin 154 pin 156 pin 158 pin 160 pin 162 pin 164 pin 166 pin 168 pin 170 pin 172 pin 174 pin 176 pin 178 pin 180 pin 182 pin 184 dq36 dq38 ras s1/nc dq47 dq53 dq54 dq60 dq62 sa1 v ddspd - - - - - - - - - - - - - - - - - - - - pin 145 pin 147 pin 149 pin 151 pin 153 pin 155 pin 157 pin 159 pin 161 pin 163 pin 165 pin 167 pin 169 pin 171 pin 173 pin 175 pin 177 pin 179 pin 181 pin 183 - - - - - - - - - - - - - - - - - - - -
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration data sheet 14 rev. 1.2, 2004-10 figure 2 block diagram raw card a 72 1 rank 8, ecc notes 1. v dd = v ddq , therefore v ddid strap open 2. dq, dqs, dm resistors are 22 ohms 5% 3. ban, an, ras , cas , we resistors are 22 ohms 5% mpbd1101 s0 d6 dm0/dqs9 dqs0 dq0 dq1 dq2 dq3 dq4 dq5 dq6 dq7 d0 dm1/dqs10 dqs1 dq8 dq9 dq10 dq11 dq12 dq13 dq14 dq15 d1 dm2/dqs11 dqs2 dq16 dq17 dq18 dq19 dq20 dq21 dq22 dq23 d2 dm5/dqs14 dqs5 dq40 dq41 dq42 dq43 dq44 dq45 dq46 dq47 d5 dm4/dqs13 dqs4 dq32 dq33 dq34 dq35 dq36 dq37 dq38 dq39 d4 dm3/dqs12 dqs3 dq24 dq25 dq26 dq27 dq28 dq29 dq30 dq31 d3 d8 d7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm6/dqs15 dqs6 dq48 dq49 dq50 dq51 dq52 dq53 dq54 dq55 dm8/dqs17 dqs8 cb0 cb1 cb2 cb3 cb4 cb5 cb6 cb7 dm7/dqs16 dqs7 dq56 dq57 dq58 dq59 dq60 dq61 dq62 dq63 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm cs dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs: sdrams d0- d8 cke: sdrams d0 - d8 ba0 - ba1: sdrams d0 - d8 a0 - an: sdrams d0 - d8 ras: sdrams d0 - d8 cas: sdrams d0 - d8 we: sdrams d0 - d8 r e g i s t e r s0 cke0 ba0 - ba1 a0 - an ras cas we pck pck reset rs0 rcke0 rba0 - rba1 ra0-ran rras rcas rwe scl sad sa0 sa1 sa2 v ss scl sad a0 a1 a2 wp e0 v dd : spd eeprom e0 v dd / v ddq : sdrams d0 - d8 v ref : sdrams d0 - d8 v ss : sdrams d0 - d8 strap: see note 1 v dd,spd v dd / v ddq v ref v ss v ddid ck0 ck0 pck pck pll
data sheet 15 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration figure 3 block diagram raw card b 72, 2ranks 8, ecc notes 1. v dd = v ddq , therefore v ddid strap open 2. dq, dqs, dm resistors are 22 ohms 5% 3. ban, an, ras , cas , we resistors are 22 ohms 5% 4. for wire per clock loading please see figure: ?diferential clock net wiring? mpbd1401 dm1/dqs10 dqs1 dq8 dq9 dq10 dq11 dq12 dq13 dq14 dq15 d1 dm2/dqs11 dqs2 dq16 dq17 dq18 dq19 dq20 dq21 dq22 dq23 d2 dm3/dqs12 dqs3 dq24 dq25 dq26 dq27 dq28 dq29 dq30 dq31 d3 d0 d8 d9 d10 d11 d12 dm8/dqs17 dqs8 cb0 cb1 cb2 cb3 cb4 cb5 cb6 cb7 d17 scl sad sa0 sa1 sa2 v ss e0 scl sad a0 a1 a2 wp r e g i s t e r s0 cke0 s1 cke1 ba0 - ba1 a0 - an ras cas we pck pck reset rs0 rcke0 rs1 rcke1 rba0 - rba1 ra0 - ran rras rcas rwe cke: sdrams d0 - d8 cke: sdrams d9 - d17 ba0 - ba1: sdrams d0 - d17 a0 - an: sdrams d0 - d17 ras: sdrams d0 - d17 cas: sdrams d0 - d17 we: sdrams d0 - d17 v dd : spd eeprom e0 v dd / v ddq : sdrams d0 - d17 v ref : sdrams d0 - d17 v ss : sdrams d0 - d17 dm: sdrams d0 - d17 v dd,spd v dd / v ddq v ref v ss v ddid strap: see note 1 s1 s0 dm0/dqs9 dqs0 dq0 dq1 dq2 dq3 dq4 dq5 dq6 dq7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 dm6/dqs15 dqs6 dq48 dq49 dq50 dq51 dq52 dq53 dq54 dq55 d6 dm7/dqs16 dqs7 dq56 dq57 dq58 dq59 dq60 dq61 dq62 dq63 d7 dm4/dqs13 dqs4 dq32 dq33 dq34 dq35 dq36 dq37 dq38 dq39 d4 d15 d14 d13 dm5/dqs14 dqs5 dq40 dq41 dq42 dq43 dq44 dq45 dq46 dq47 d5 d16 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 cs dm dqs i/o 0 i/o 1 i/o 2 i/o 3 i/o 4 i/o 5 i/o 6 i/o 7 pll pck pck ck0 ck0
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration data sheet 16 rev. 1.2, 2004-10 figure4block diagram raw card c 72 1 rank 4, ecc notes 1. v dd = v ddq , therefore v ddid strap open 2. dq, dqs, dm resistors are 22 ohms 5% 3. ban, an, ras , cas , we resistors are 22 ohms 5% mpbd1501 dqs0 dq0 dq1 dq2 dq3 d0 d1 dqs1 dq8 dq9 dq10 dq11 d2 d3 d4 d5 dqs2 dq16 dq17 dq18 dq19 dqs3 dq24 dq25 dq26 dq27 dqs17 cb4 cb5 cb6 cb7 dqs12 dq28 dq29 dq30 dq31 dqs15 dq52 dq53 dq54 dq55 d12 dqs16 dq60 dq61 dq62 dq63 d13 dqs14 dq44 dq45 dq46 dq47 d14 dqs5 dq40 dq41 dq42 dq43 d15 dqs4 dq32 dq33 dq34 dq35 d16 d17 dqs13 dq36 dq37 dq38 dq39 d6 d7 d8 dqs7 dq56 dq57 dq58 dq59 dqs6 dq48 dq49 dq50 dq51 dqs8 cb0 cb1 cb2 cb3 dqs10 dq12 dq13 dq14 dq15 dqs9 dq4 dq5 dq6 dq7 dqs11 dq20 dq21 dq22 dq23 d9 d10 d11 scl sad sa0 sa1 sa2 v ss scl sad a0 a1 a2 wp e0 rs0 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cs: sdrams d0- d17 cke: sdrams d0 - d17 ba0 - ba1: sdrams d0 - d17 a0 - an: sdrams d0 - d17 ras: sdrams d0 - d17 cas: sdrams d0 - d17 we: sdrams d0 - d17 r e g i s t e r s0 cke0 ba0 - ba1 a0 - an ras cas we pck pck reset rs0 rcke0 rba0 - rba1 ra0 - ran rras rcas rwe v dd : spd eeprom e0 v dd / v ddq : sdrams d0 - d17 v ref : sdrams d0 - d17 v ss : sdrams d0 - d17 strap: see note 1 v dd,spd v dd / v ddq v ref v ss v ddid ck0 ck0 pck pck pll
data sheet 17 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram pin configuration figure 5 block diagram raw card d 72 2 ranks 4, ecc notes 1. v dd = v ddq , therefore v ddid strap open 2. dq, dqs, dm resistors are 18 ohms 5% 3. ban, an, ras , cas , we resistors are 22 ohms 5% 4. for wire per clock loading please see figure ?differental clock net wiring? mpbd1061 dqs0 dq0 dq1 dq2 dq3 d4 d6 d0 d2 dqs1 dq8 dq9 dq10 dq11 d12 d14 dqs10 dq12 dq13 dq14 dq15 d8 d10 dqs9 dq4 dq5 dq6 dq7 d20 d22 dqs11 dq20 dq21 dq22 dq23 d16 d18 dqs2 dq16 dq17 dq18 dq19 d24 d26 dqs3 dq24 dq25 dq26 dq27 d28 d30 dqs17 cb4 cb5 cb6 cb7 d32 d34 dqs12 dq28 dq29 dq30 dq31 dqs7 dq56 dq57 dq58 dq59 d5 d7 d1 d3 dqs6 dq48 dq49 dq50 dq51 d13 d15 dqs15 dq52 dq53 dq54 dq55 d9 d11 dqs16 dq60 dq61 dq62 dq63 d21 d23 dqs14 dq44 dq45 dq46 dq47 d17 d19 dqs5 dq40 dq41 dq42 dq43 d25 d27 dqs4 dq32 dq33 dq34 dq35 d28 d31 dqs8 cb0 cb1 cb2 cb3 d33 d35 dqs13 dq36 dq37 dq38 dq39 rs0 rcke0 rs1 rcke1 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 ba0 - ba1: sdrams d0 - d35 a0 - an: sdrams d0 - d35 ras: sdrams d0 - d35 cas: sdrams d0 - d35 we: sdrams d0 - d35 r e g i s t e r s0 cke0 s1 cke1 ba0 - ba1 a0 - an ras cas we pck pck reset rs0 rcke0 rs1 rcke1 rba0 - rba1 ra0-ran rras rcas rwe scl sad sa0 sa1 sa2 v ss e0 scl sad a0 a1 a2 wp v dd : spd eeprom e0 v dd / v ddq : sdrams d0 - d35 v ref : sdrams d0 - d35 v ss : sdrams d0 - d35 dm: sdrams d0 - d35 v dd,spd v dd / v ddq v ref v ss v ddid strap: see note 1 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 cke cs dqs i/o 0 i/o 1 i/o 2 i/o 3 pll pck pck ck0 ck0
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram electrical characteristics data sheet 18 rev. 1.2, 2004-10 07302003-2mi6-fop1 3 electrical characteristics 3.1 operating conditions attention: permanent damage to the device may occu r if ?absolute maximum ratings? are exceeded. this is a stress rating only, and functional operati on should be restricted to recommended operation conditions. exposure to absolute maximum rating conditions for extended periods of time may affect device reliability and exceeding only one of the values may cause irreversible damage to the integrated circuit. table 8 absolute maximum ratings parameter symbol values unit note/ test condition min. typ. max. voltage on i/o pins relative to v ss v in , v out ?0.5 ? v ddq +0.5 v ? voltage on inputs relative to v ss v in ?1 ? +3.6 v ? voltage on v dd supply relative to v ss v dd ?1 ? +3.6 v ? voltage on v ddq supply relative to v ss v ddq ?1 ? +3.6 v ? operating temperature (ambient) t a 0?+70 c? storage temperature (plastic) t stg -55 ? +150 c? power dissipation (per sdram component) p d ?1? w? short circuit output current i out ?50? ma? table 9 electrical characteristics and dc operating conditions parameter symbol values unit note/test condition 1) min. typ. max. device supply voltage v dd 2.3 2.5 2.7 v f ck 166 mhz device supply voltage v dd 2.5 2.6 2.7 v f ck >166mhz 2) output supply voltage v ddq 2.3 2.5 2.7 v f ck 166 mhz 3) output supply voltage v ddq 2.5 2.6 2.7 v f ck >166mhz 2)3) eeprom supply voltage v ddspd 2.3 2.5 3.6 v ? supply voltage, i/o supply voltage v ss , v ssq 00v? input reference voltage v ref 0.49 v ddq 0.5 v ddq 0.51 v ddq v 4) i/o termination voltage (system) v tt v ref ? 0.04 v ref + 0.04 v 5) input high (logic1) voltage v ih(dc) v ref + 0.15 v ddq + 0.3 v 8) input low (logic0) voltage v il(dc) ?0.3 v ref ? 0.15 v 8) input voltage level, ck and ck inputs v in(dc) ?0.3 v ddq + 0.3 v 8) input differential voltage, ck and ck inputs v id(dc) 0.36 v ddq + 0.6 v 8)6) vi-matching pull-up current to pull-down current vi ratio 0.71 1.4 ? 7)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram electrical characteristics data sheet 19 rev. 1.2, 2004-10 07302003-2mi6-fop1 input leakage current i i ?2 2 a any input 0 v v in v dd ; all other pins not under test =0v 8)9) output leakage current i oz ?5 5 a dqs are disabled; 0v v out v ddq output high current, normal strength driver i oh ? ?16.2 ma v out = 1.95 v output low current, normal strength driver i ol 16.2 ? ma v out = 0.35 v 1) 0 c t a 70 c 2) ddr400 conditions apply for all clock frequencies above 166 mhz 3) under all conditions, v ddq must be less than or equal to v dd . 4) peak to peak ac noise on v ref may not exceed 2% v ref (dc) . v ref is also expected to track noise variations in v ddq . 5) v tt is not applied dire ctly to the device. v tt is a system supply for signal termination resistors, is expected to be set equal to v ref , and must track variations in the dc level of v ref . 6) v id is the magnitude of the difference between th e input level on ck and the input level on ck . 7) the ratio of the pull-up current to the pull-down current is specified for the sa me temperature and volt age, over the entire temperature and voltage range, for device drain to source volt age from 0.25 to 1.0 v. for a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation. 8) inputs are not recognized as valid until v ref stabilizes. 9) values are shown per ddr sdram component table 9 electrical characteristics and dc operating conditions (cont?d) parameter symbol values unit note/test condition 1) min. typ. max.
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 20 rev. 1.2, 2004-10 07302003-2mi6-fop1 4 current specification and conditions table 10 i dd conditions parameter symbol operating current 0 one bank; active/ precharge; dq, dm, and dq s inputs changing once per clock cycle; address and control inputs chan ging once every two clock cycles. i dd0 operating current 1 one bank; active/read/precharge; burst length = 4; see component data sheet. i dd1 precharge power-down standby current all banks idle; powe r-down mode; cke v il,max i dd2p precharge floating standby current cs v ih,,min , all banks idle; cke v ih,min ; address and other control inputs changing once per clock cycle; v in = v ref for dq, dqs and dm. i dd2f precharge quiet standby current cs v ihmin , all banks idle; cke v ih,min ; v in = v ref for dq, dqs and dm; address and other control inputs stable at v ih,min or v il,max . i dd2q active power-down standby current one bank active; power-down mode; cke v ilmax ; v in = v ref for dq, dqs and dm. i dd3p active standby current one bank active; cs v ih,min ; cke v ih,min ; t rc = t ras,max ; dq, dm and dqs inputs changing twice per clock cycle; address and control inputs c hanging once per clock cycle. i dd3n operating current read one bank active; burst length = 2; reads; continuous burst; address and control inputs c hanging once per clock cycle; 50% of data outputs changing on every clock edge; cl = 2 for ddr266(a), cl = 3 for ddr333 and ddr400b; i out =0ma i dd4r operating current write one bank active; burst length = 2; writes; continuous burst; address and control inputs c hanging once per clock cycle; 50% of data outputs changing on every clock edge; cl = 2 for ddr266(a), cl = 3 for ddr333 and ddr400b i dd4w auto-refresh current t rc = t rfcmin , burst refresh i dd5 self-refresh current cke 0.2 v; external clock on i dd6 operating current 7 four bank interleaving with burst length = 4; see component data sheet. i dd7
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 21 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 11 i dd specification for hys72d[128/64/32]3xxx[g/h]br?5?c product type hys72d32300gbr?5?c hys72d32300hbr-?5?c hys72d64300gbr?5?c hys72d64300hbr?5?c hys72d64320gbr?5?c hys72d64320hbr?5?c unit note/ test conditions 1) 2) 1) test condition fo r maximum values: v dd =2.7v, t a =10c 2) module i dd is calculated on the basis of component i dd and includes register and pll organization 256 mb 512 mb 512 mb 72 72 72 1 rank 1 rank 2 ranks ?5 ?5 ?5 symbol typ. max. typ. max. typ. max. i dd0 1140 1370 2070 2480 1780 2080 ma 3) 3) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) n * i dd [component] + n * i dd3n [component] for two bank modules (n: number of components per module bank) i dd1 1360 1600 2380 2800 2000 2310 ma 3)4) 4) dq i/o ( i ddq ) currents are not included into calculations: module i dd values will be measured differently depending on load conditions i dd2p 390 440 730 790 730 790 ma 5) 5) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) 2 * n * i dd [component] for single two bank modules (n : number of components per module bank) i dd2f 880 990 1450 1620 1450 1620 ma 5) i dd2q 540 650 1020 1200 1020 1200 ma 5) i dd3p 470 560 890 720 890 1020 ma 5) i dd3n 950 1080 1590 1780 1590 1780 ma 5) i dd4r 1400 1600 2470 2800 2040 2310 ma 3)4) i dd4w 1450 1650 2560 2890 2090 2350 ma 3) i dd5 1630 2120 3190 4130 2270 2830 ma 3) i dd6 330 370 640 700 640 700 ma 5) i dd7 2530 2950 4720 5500 3170 3660 ma 3)4)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 22 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 12 i dd specification for hys72d[256/128/64/32]3xxx[g/h]br?6?c product type hys72d32300gbr?6?c hys72d32300hbr?6?c hys72d64300gbr?6?c hys72d64300hbr?6?c hys72d64320gbr?6?c hys72d64320hbr?6?c hys72d128320gbr?6?c hys72d128320hbr?6?c unit note/ test conditions 1) 2) 1) test condition fo r maximum values: v dd =2.7v, t a =10c 2) module i dd is calculated on the basis of component i dd and includes register and pll organization 256 mb 512 mb 512 mb 1 gb 72 72 72 72 1 rank 1 rank 2 ranks 2 ranks ?6 ?6 ?6 ?6 symbol typ. max. typ. max. typ. max. typ. max. i dd0 1000 1190 1790 2110 1540 1780 2870 3290 ma 3) 3) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) n * i dd [component] + n * i dd3n [component] for two bank modules (n: number of components per module bank) i dd1 1210 1410 2090 2420 1750 2000 3160 3600 ma 3)4) 4) dq i/o ( i ddq ) currents are not included into calculations: module i dd values will be measured differently depending on load conditions i dd2p 370 410 650 710 650 710 1220 1300 ma 5) 5) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) 2 * n * i dd [component] for single two bank modules (n : number of components per module bank) i dd2f 780 880 1250 1400 1250 1400 2200 2440 ma 5) i dd2q 480 580 890 1050 890 1050 1690 1980 ma 5) i dd3p 430 500 780 640 780 890 1480 1660 ma 5) i dd3n 840 950 1380 1540 1380 1540 2450 2730 ma 5) i dd4r 1210 1410 2090 2420 1750 2000 3160 3600 ma 3)4) i dd4w 1250 1450 2180 2510 1790 2040 3250 3690 ma 3) i dd5 1420 1820 2750 3510 1960 2410 3830 4690 ma 3) i dd6 320 370 580 640 580 640 1110 1190 ma 5) i dd7 2200 2580 4070 4760 2740 3170 5140 5940 ma 3)4)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 23 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 13 i dd specification for hys72d[128/64/32]3xxx[g/h]br?7?c product type hys72d32300gbr-7-c hys72d32300hbr-7-c hys72d64300gbr-7-c hys72d64300hbr-7-c HYS72D128320GBR-7-C hys72d128320hbr-7-c unit note/ test conditions 1) 2) 1) test condition fo r maximum values: v dd =2.7v, t a =10c 2) module i dd is calculated on the basis of component i dd and includes register and pll organization 256 mb 512 mb 1 gb 72 72 72 1 rank 1 rank 2 ranks ?7 ?7 ?7 symbol typ. max. typ. max. typ. max. i dd0 860 1040 1510 1830 2410 2870 ma 3) 3) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) n * i dd [component] + n * i dd3n [component] for two bank modules (n: number of components per module bank) i dd1 1100 1250 1890 2120 2790 3170 ma 3)4) 4) dq i/o ( i ddq ) currents are not included into calculations: module i dd values will be measured differently depending on load conditions i dd2p 330 370 560 610 1010 1080 ma 5) 5) the module i dd values are calculated from the component i dd datasheet values are: n * i dd [component] for single bank modules (n: number of components per module bank) 2 * n * i dd [component] for single two bank modules (n : number of components per module bank) i dd2f 670 760 1050 1180 1810 2010 ma 5) i dd2q 440 520 770 910 1440 1690 ma 5) i dd3p 380 450 660 570 1230 1400 ma 5) i dd3n 740 870 1200 1390 2100 2440 ma 5) i dd4r 1060 1200 1800 2030 2700 3080 ma 3)4) i dd4w 1100 1250 1890 2120 2790 3170 ma 3) i dd5 1210 1600 2310 3060 3210 4110 ma 3) i dd6 300 350 520 580 940 1030 ma 5) i dd7 1780 2100 3240 3830 4140 4880 ma 3)4)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 24 rev. 1.2, 2004-10 07302003-2mi6-fop1 4.1 ac characteristics table 14 ac timing - absolute specifications for pc3200 and pc2700 parameter symbol ?5 ?6 unit note/ test condition 1) ddr400b ddr333 min. max. min. max. dq output access time from ck/ck t ac ?0.5 +0.5 ?0.7 +0.7 ns 2)3)4)5) ck high-level width t ch 0.45 0.55 0.45 0.55 t ck 2)3)4)5) clock cycle time t ck 5 8 6 12 ns cl = 3.0 2)3)4)5) 6 12 6 12 ns cl = 2.5 2)3)4)5) 7.5 12 7.5 12 ns cl = 2.0 2)3)4)5) ck low-level width t cl 0.45 0.55 0.45 0.55 t ck 2)3)4)5) auto precharge write recovery + precharge time t dal ( t wr / t ck )+( t rp / t ck ) t ck 2)3)4)5)6) dq and dm input hold time t dh 0.4 ? 0.45 ? ns 2)3)4)5) dq and dm input pulse width (each input) t dipw 1.75 ? 1.75 ? ns 2)3)4)5)6) dqs output access time from ck/ck t dqsck ?0.6 +0.6 ?0.6 +0.6 ns 2)3)4)5) dqs input low (high) pulse width (write cycle) t dqsl,h 0.35 ? 0.35 ? t ck 2)3)4)5) dqs-dq skew (dqs and associated dq signals) t dqsq ? +0.40 ? +0.40 ns tfbga 2)3)4)5) write command to 1 st dqs latching transition t dqss 0.72 1.25 0.75 1.25 t ck 2)3)4)5) dq and dm input setup time t ds 0.4 ? 0.45 ? ns 2)3)4)5) dqs falling edge hold time from ck (write cycle) t dsh 0.2 ? 0.2 ? t ck 2)3)4)5) dqs falling edge to ck setup time (write cycle) t dss 0.2 ? 0.2 ? t ck 2)3)4)5) clock half period t hp min. ( t cl , t ch )min. ( t cl , t ch )ns 2)3)4)5) data-out high-impedance time from ck/ck t hz ? +0.7 ?0.7 +0.7 ns 2)3)4)5)7) address and control input hold time t ih 0.6 ? 0.75 ? ns fast slew rate 3)4)5)6)8) 0.7 ? 0.8 ? ns slow slew rate 3)4)5)6)8) control and addr. input pulse width (each input) t ipw 2.2 ? 2.2 ? ns 2)3)4)5)9) address and control input setup time t is 0.6 ? 0.75 ? ns fast slew rate 3)4)5)6)8) 0.7 ? 0.8 ? ns slow slew rate 3)4)5)6)8)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 25 rev. 1.2, 2004-10 07302003-2mi6-fop1 data-out low-impedance time from ck/ck t lz ?0.7 +0.7 ?0.7 +0.7 ns 2)3)4)5)7) mode register set command cycle time t mrd 2?2? t ck 2)3)4)5) dq/dqs output hold time t qh t hp ? t qhs t hp ? t qhs ns 2)3)4)5) data hold skew factor t qhs ? +0.50 ? +0.50 ns tfbga 2)3)4)5) active to autoprecharge delay t rap t rcd or t rasmin ? t rcd or t rasmin ?ns 2)3)4)5) active to precharge command t ras 40 70e+3 42 70e+3 ns 2)3)4)5) active to active/auto-refresh command period t rc 55 ? 60 ? ns 2)3)4)5) active to read or write delay t rcd 15 ? 18 ? ns 2)3)4)5) average periodic refresh interval t refi ? 7.8 ? 7.8 s 2)3)4)5)10) auto-refresh to active/auto- refresh command period t rfc 70 ? 72 ? ns 2)3)4)5) precharge command period t rp 15 ? 18 ? ns 2)3)4)5) read preamble t rpre 0.9 1.1 0.9 1.1 t ck 2)3)4)5) read postamble t rpst 0.40 0.60 0.40 0.60 t ck 2)3)4)5) active bank a to active bank b command t rrd 10 ? 12 ? ns 2)3)4)5) write preamble t wpre 0.25 ? 0.25 ? t ck 2)3)4)5) write preamble setup time t wpres 0?0?ns 2)3)4)5)11) write postamble t wpst 0.40 0.60 0.40 0.60 t ck 2)3)4)5)12) write recovery time t wr 15 ? 15 ? ns 2)3)4)5) internal write to read command delay t wtr 2?1? t ck 2)3)4)5) exit self-refresh to non-read command t xsnr 75 ? 75 ? ns 2)3)4)5) exit self-refresh to read command t xsrd 200 ? 200 ? t ck 2)3)4)5) 1) 0 c t a 70 c ; v ddq = 2.5 v 0.2 v, v dd = +2.5 v 0.2 v (ddr333); v ddq = 2.6 v 0.1 v, v dd = +2.6 v 0.1 v (ddr400) 2) input slew rate 1 v/ns for ddr400, ddr333 3) the ck/ck input reference level (for timing reference to ck/ck ) is the point at which ck and ck cross: the input reference level for signals other than ck/ck , is v ref . ck/ck slew rate are 1.0 v/ns. 4) inputs are not recognized as valid until v ref stabilizes. 5) the output timing reference level, as measured at the timing reference point indicated in ac characteristics (note 3) is v tt . 6) for each of the terms, if not already an in teger, round to the next highest integer. t ck is equal to the actual system clock cycle time. 7) t hz and t lz transitions occur in the same acce ss time windows as valid data transitions. these parameters are not referred to a specific voltage level, but sp ecify when the device is no longer driv ing (hz), or begins driving (lz). table 14 ac timing - absolute specifications for pc3200 and pc2700 parameter symbol ?5 ?6 unit note/ test condition 1) ddr400b ddr333 min. max. min. max.
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 26 rev. 1.2, 2004-10 07302003-2mi6-fop1 8) fast slew rate 1.0 v/ns , slow slew rate 0.5 v/ns and < 1 v/ns for command/address and ck & ck slew rate > 1.0 v/ns, measured between v ih(ac) and v il(ac) . 9) these parameters guarantee device timing, but they are not necessarily tested on each device. 10) a maximum of eight autorefresh commands can be posted to any given ddr sdram device. 11) the specific requirement is th at dqs be valid (high,low, or some point on a valid transition) on or before this ck edge. a valid transition is defined as monotonic and meeting the input slew rate specificat ionsof the device. when no writes were previously in progress on the bus, dqs will be transitioning fr om hi-z to logic low. if a previous write was in progress, dqs could be high, low at this time, depending on t dqss . 12) the maximum limit for this parameter is not a device limit. the device operates with a greater value for th is parameter, but system performance (bus turnar ound) degrades accordingly. table 15 ac timing - absolute specifications for pc2700 parameter symbol ?7 unit note/test condition 1) ddr266a min. max. dq output access time from ck/ck t ac ?0.75 +0.75 ns 2)3)4)5) ck high-level width t ch 0.45 0.55 t ck 2)3)4)5) clock cycle time t ck 7.5 12 ns cl = 2.5 2)3)4)5) 7.5 12 ns cl = 2.0 2)3)4)5) ck low-level width t cl 0.45 0.55 t ck 2)3)4)5) auto precharge write recovery + precharge time t dal ( t wr / t ck )+( t rp / t ck )? t ck 2)3)4)5)6) dq and dm input hold time t dh 0.5 ? ns 2)3)4)5) dq and dm input pulse width (each input) t dipw 1.75 ? ns 2)3)4)5)6) dqs output access time from ck/ck t dqsck ?0.75 +0.75 ns 2)3)4)5) dqs input low (high) pul se width (write cycle) t dqsl,h 0.35 ? t ck 2)3)4)5) dqs-dq skew (dqs and associated dq signals) t dqsq ?+0.5nsfbga 2)3)4)5) write command to 1 st dqs latching transition t dqss 0.75 1.25 t ck 2)3)4)5) dq and dm input setup time t ds 0.5 ? ns 2)3)4)5) dqs falling edge hold time from ck (write cycle) t dsh 0.2 ? t ck 2)3)4)5) dqs falling edge to ck setup time (write cycle) t dss 0.2 ? t ck 2)3)4)5) clock half period t hp min. ( t cl , t ch )? ns 2)3)4)5) data-out high-impedance time from ck/ck t hz ?0.75 +0.75 ns 2)3)4)5)7) address and control input hold time t ih 0.9 ? ns fast slew rate 3)4)5)6)8) 1.0 ? ns slow slew rate 3)4)5)6)8) control and addr. input pulse width (each input) t ipw 2.2 ? ns 2)3)4)5)9)
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 27 rev. 1.2, 2004-10 07302003-2mi6-fop1 address and control input setup time t is 0.9 ? ns fast slew rate 3)4)5)6)8) 1.0 ? ns slow slew rate 3)4)5)6)8) data-out low-impedance time from ck/ck t lz ?0.75 +0.75 ns 2)3)4)5)7) mode register set command cycle time t mrd 2? t ck 2)3)4)5) dq/dqs output hold time t qh t hp ? t qhs ns 2)3)4)5) data hold skew factor t qhs ?0.75nsfbga 2)3)4)5) active to read w/ap delay t rap t rcd or t rasmin ?ns 2)3)4)5) active to precharge command t ras 45 120e+3 ns 2)3)4)5) active to active/auto-refresh command period t rc 65 ? ns 2)3)4)5) active to read or write delay t rcd 20 ? ns 2)3)4)5) average periodic refresh interval t refi 7.8 ? s 2)3)4)5)10) auto-refresh to ac tive/auto-refresh command period t rfc 75 ? ns 2)3)4)5) precharge command period t rp 20 ? ns 2)3)4)5) read preamble t rpre 0.9 1.1 t ck 2)3)4)5) read postamble t rpst 0.4 0.6 t ck 2)3)4)5) active bank a to active bank b command t rrd 15 ? ns 2)3)4)5) write preamble t wpre 0.25 ? t ck 2)3)4)5) write preamble setup time t wpres 0?ns 2)3)4)5)11) write postamble t wpst 0.4 ? t ck 2)3)4)5)12) write recovery time t wr 15 ? ns 2)3)4)5) internal write to read command delay t wtr 1? t ck 2)3)4)5) exit self-refresh to non-read command t xsnr 75 ns 2)3)4)5)13) exit self-refresh to read command t xsrd 200 ? t ck 2)3)4)5) 1) v ddq = 2.5 v 0.2 v, v dd = +2.5 v 0.2 v ; 0 c t a 70 c 2) input slew rate 1 v/ns 3) the ck/ck input reference level (for timing reference to ck/ck ) is the point at which ck and ck cross: the input reference level for signals other than ck/ck , is v ref . ck/ck slew rate are 1.0 v/ns. 4) inputs are not recognized as valid until v ref stabilizes. 5) the output timing reference level, as measured at the timing reference point indicated in ac characteristics (note 3) is v tt . 6) for each of the terms, if not already an in teger, round to the next highest integer. t ck is equal to the actual system clock cycle time. 7) t hz and t lz transitions occur in the same acce ss time windows as valid data transitions. these parameters are not referred to a specific voltage level, but sp ecify when the device is no longer driv ing (hz), or begins driving (lz). 8) fast slew rate 1.0 v/ns , slow slew rate 0.5 v/ns and < 1 v/ns for command/address and ck & ck slew rate > 1.0 v/ns, measured between v ih(ac) and v il(ac) . 9) these parameters guarantee device timing, but they are not necessarily tested on each device. 10) a maximum of eight autorefresh commands can be posted to any given ddr sdram device. table 15 ac timing - absolute specifications for pc2700 parameter symbol ?7 unit note/test condition 1) ddr266a min. max.
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram current specification and conditions data sheet 28 rev. 1.2, 2004-10 07302003-2mi6-fop1 11) the specific requirement is that dqs be valid (high, low, or some point on a vali d transition) on or before this ck edge. a valid transition is defined as monotonic and meeting the input slew rate specifications of the device. when no writes were previously in progress on the bus, dqs will be transitioning fr om hi-z to logic low. if a previous write was in progress, dqs could be high, low, or transitioning fr om high to low at this time, depending on t dqss . 12) the maximum limit for this parameter is not a device limit. the device operates with a greater value for th is parameter, but system performance (bus turnar ound) degrades accordingly. 13) in all circumstances, t xsnr can be satisfied using t xsnr = t rfc,min +1 t ck
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 29 rev. 1.2, 2004-10 07302003-2mi6-fop1 5spdcontents table 16 spd codes for hys72d[128/64/32]3xxgbr?5?c product type & organization hys72d64320gbr?5?c hys72d64300gbr?5?c hys72d32300gbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex 0 programmed spd bytes in e2prom 80 80 80 1 total number of bytes in e2prom 08 08 08 2 memory type (ddr = 07h) 07 07 07 3 number of row addresses 0d 0d 0d 4 number of column addresses 0a 0b 0a 5 number of dimm ranks 02 01 01 6 data width (lsb) 48 48 48 7 data width (msb) 00 00 00 8 interface voltage levels 04 04 04 9 t ck @ clmax (byte 18) [ns] 50 50 50 10 t ac sdram @ clmax (byte 18) [ns] 50 50 50 11 error correction support 02 02 02 12 refresh rate 82 82 82 13 primary sdram width 08 04 08 14 error checking sdram width 08 04 08 15 t ccd [cycles] 010101 16 burst length supported 0e 0e 0e 17 number of banks on sdram device 04 04 04 18 cas latency 1c 1c 1c 19 cs latency 01 01 01 20 write latency 02 02 02 21 dimm attributes 26 26 26 22 component attributes c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 60 60 60 24 t ac sdram @ clmax -0.5 [ns] 50 50 50 25 t ck @ clmax -1 (byte 18) [ns] 75 75 75 26 t ac sdram @ clmax -1 [ns] 50 50 50
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 30 rev. 1.2, 2004-10 07302003-2mi6-fop1 27 t rpmin [ns] 3c 3c 3c 28 t rrdmin [ns] 28 28 28 29 t rcdmin [ns] 3c 3c 3c 30 t rasmin [ns] 28 28 28 31 module density per rank 40 80 40 32 t as , t cs [ns] 60 60 60 33 t ah , t ch [ns] 60 60 60 34 t ds [ns] 40 40 40 35 t dh [ns] 40 40 40 36 - 40 not used 00 00 00 41 t rcmin [ns] 37 37 37 42 t rfcmin [ns] 41 41 41 43 t ckmax [ns] 28 28 28 44 t dqsqmax [ns] 28 28 28 45 t qhsmax [ns] 50 50 50 46 not used 00 00 00 47 dimm pcb height 01 01 01 48 - 61 not used 00 00 00 62 spd revision 10 10 10 63 checksum of byte 0-62 27 5f 26 64 jedec id code of infineon (1) c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 72 module manufacturer location xx xx xx 73 part number, char 1 37 37 37 74 part number, char 2 32 32 32 75 part number, char 3 44 44 44 76 part number, char 4 36 36 33 77 part number, char 5 34 34 32 table 16 spd codes for hys72d[128/64/32]3xxgbr?5?c (cont?d) product type & organization hys72d64320gbr?5?c hys72d64300gbr?5?c hys72d32300gbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 31 rev. 1.2, 2004-10 07302003-2mi6-fop1 78 part number, char 6 33 33 33 79 part number, char 7 32 30 30 80 part number, char 8 30 30 30 81 part number, char 9 47 47 47 82 part number, char 10 42 42 42 83 part number, char 11 52 52 52 84 part number, char 12 35 35 35 85 part number, char 13 43 43 43 86 part number, char 14 20 20 20 87 part number, char 15 20 20 20 88 part number, char 16 20 20 20 89 part number, char 17 20 20 20 90 part number, char 18 20 20 20 91 module revision code xx xx xx 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx 99 - 127 not used 00 00 00 table 16 spd codes for hys72d[128/64/32]3xxgbr?5?c (cont?d) product type & organization hys72d64320gbr?5?c hys72d64300gbr?5?c hys72d32300gbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 32 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 17 spd codes for hys72d[128/64/32]3xxhbr?5?c product type & organization hys72d64320hbr?5?c hys72d64300ghr?5?c hys72d32300hbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex 0 programmed spd bytes in e2prom 80 80 80 1 total number of bytes in e2prom 08 08 08 2 memory type (ddr = 07h) 07 07 07 3 number of row addresses 0d 0d 0d 4 number of column addresses 0a 0b 0a 5 number of dimm ranks 02 01 01 6 data width (lsb) 48 48 48 7 data width (msb) 00 00 00 8 interface voltage levels 04 04 04 9 t ck @ clmax (byte 18) [ns] 50 50 50 10 t ac sdram @ clmax (byte 18) [ns] 50 50 50 11 error correction support 02 02 02 12 refresh rate 82 82 82 13 primary sdram width 08 04 08 14 error checking sdram width 08 04 08 15 t ccd [cycles] 010101 16 burst length supported 0e 0e 0e 17 number of banks on sdram device 04 04 04 18 cas latency 1c 1c 1c 19 cs latency 01 01 01 20 write latency 02 02 02 21 dimm attributes 26 26 26 22 component attributes c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 60 60 60 24 t ac sdram @ clmax -0.5 [ns] 50 50 50 25 t ck @ clmax -1 (byte 18) [ns] 75 75 75 26 t ac sdram @ clmax -1 [ns] 50 50 50
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 33 rev. 1.2, 2004-10 07302003-2mi6-fop1 27 t rpmin [ns] 3c 3c 3c 28 t rrdmin [ns] 28 28 28 29 t rcdmin [ns] 3c 3c 3c 30 t rasmin [ns] 28 28 28 31 module density per rank 40 80 40 32 t as , t cs [ns] 60 60 60 33 t ah , t ch [ns] 60 60 60 34 t ds [ns] 40 40 40 35 t dh [ns] 40 40 40 36 - 40 not used 00 00 00 41 t rcmin [ns] 37 37 37 42 t rfcmin [ns] 41 41 41 43 t ckmax [ns] 28 28 28 44 t dqsqmax [ns] 28 28 28 45 t qhsmax [ns] 50 50 50 46 not used 00 00 00 47 dimm pcb height 01 01 01 48 - 61 not used 00 00 00 62 spd revision 10 10 10 63 checksum of byte 0-62 27 5f 26 64 jedec id code of infineon (1) c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 72 module manufacturer location xx xx xx 73 part number, char 1 37 37 37 74 part number, char 2 32 32 32 75 part number, char 3 44 44 44 76 part number, char 4 36 36 33 77 part number, char 5 34 34 32 table 17 spd codes for hys72d[128/64/32]3xxhbr?5?c (cont?d) product type & organization hys72d64320hbr?5?c hys72d64300ghr?5?c hys72d32300hbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 34 rev. 1.2, 2004-10 07302003-2mi6-fop1 78 part number, char 6 33 33 33 79 part number, char 7 32 30 30 80 part number, char 8 30 30 30 81 part number, char 9 48 48 48 82 part number, char 10 42 42 42 83 part number, char 11 52 52 52 84 part number, char 12 35 35 35 85 part number, char 13 43 43 43 86 part number, char 14 20 20 20 87 part number, char 15 20 20 20 88 part number, char 16 20 20 20 89 part number, char 17 20 20 20 90 part number, char 18 20 20 20 91 module revision code xx xx xx 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx 99 - 127 not used 00 00 00 table 17 spd codes for hys72d[128/64/32]3xxhbr?5?c (cont?d) product type & organization hys72d64320hbr?5?c hys72d64300ghr?5?c hys72d32300hbr?5?c 512 mb 512 mb 256 mb 72 72 72 2 ranks 1 rank 1 rank label code pc3200r?30331 pc3200r?30331 pc3200r?30331 jedec spd revision rev 1.0 rev 1.0 rev 1.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 35 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 18 spd codes for hys72d[128/64/32]3xxgbr?6?c product type & organization hys72d128320gbr?6?c hys72d64320gbr?6?c hys72d64300gbr?6?c hys72d32300gbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex 0 programmed spd bytes in e2prom 80 80 80 80 1 total number of bytes in e2prom 08 08 08 08 2 memory type (ddr = 07h) 07 07 07 07 3 number of row addresses 0d 0d 0d 0d 4 number of column addresses 0b 0a 0b 0a 5 number of dimm ranks 02 02 01 01 6 data width (lsb) 48 48 48 48 7 data width (msb) 00 00 00 00 8 interface voltage levels 04 04 04 04 9 t ck @ clmax (byte 18) [ns] 60 60 60 60 10 t ac sdram @ clmax (byte 18) [ns] 70 70 70 70 11 error correction support 02 02 02 02 12 refresh rate 82 82 82 82 13 primary sdram width 04 08 04 08 14 error checking sdram width 04 08 04 08 15 t ccd [cycles] 01 01 01 01 16 burst length supported 0e 0e 0e 0e 17 number of banks on sdram device 04 04 04 04 18 cas latency 0c 0c 0c 0c 19 cs latency 01 01 01 01 20 write latency 02 02 02 02 21 dimm attributes 26 26 26 26 22 component attributes c1 c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 75 75 75 75 24 t ac sdram @ clmax -0.5 [ns] 70 70 70 70 25 t ck @ clmax -1 (byte 18) [ns] 00 00 00 00
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 36 rev. 1.2, 2004-10 07302003-2mi6-fop1 26 t ac sdram @ clmax -1 [ns] 00 00 00 00 27 t rpmin [ns] 48 48 48 48 28 t rrdmin [ns] 30 30 30 30 29 t rcdmin [ns] 48 48 48 48 30 t rasmin [ns] 2a 2a 2a 2a 31 module density per rank 80 40 80 40 32 t as , t cs [ns] 75 75 75 75 33 t ah , t ch [ns] 75 75 75 75 34 t ds [ns] 45 45 45 45 35 t dh [ns] 45 45 45 45 36 - 40 not used 00 00 00 00 41 t rcmin [ns] 3c 3c 3c 3c 42 t rfcmin [ns] 48 48 48 48 43 t ckmax [ns] 30 30 30 30 44 t dqsqmax [ns] 28 28 28 28 45 t qhsmax [ns] 50 50 50 50 46 not used 00 00 00 00 47 dimm pcb height 00 00 00 00 48 - 61 not used 00 00 00 00 62 spd revision 00 00 00 00 63 checksum of byte 0-62 49 10 48 0f 64 jedec id code of infineon (1) c1 c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 00 72 module manufacturer location xx xx xx xx 73 part number, char 1 37 37 37 37 74 part number, char 2 32 32 32 32 75 part number, char 3 44 44 44 44 table 18 spd codes for hys72d[128/64/32]3xxgbr?6?c (cont?d) product type & organization hys72d128320gbr?6?c hys72d64320gbr?6?c hys72d64300gbr?6?c hys72d32300gbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 37 rev. 1.2, 2004-10 07302003-2mi6-fop1 76 part number, char 4 31 36 36 33 77 part number, char 5 32 34 34 32 78 part number, char 6 38 33 33 33 79 part number, char 7 33 32 30 30 80 part number, char 8 32 30 30 30 81 part number, char 9 30 47 47 47 82 part number, char 10 47 42 42 42 83 part number, char 11 42 52 52 52 84 part number, char 12 52 36 36 36 85 part number, char 13 36 43 43 43 86 part number, char 14 43 20 20 20 87 part number, char 15 20 20 20 20 88 part number, char 16 20 20 20 20 89 part number, char 17 20 20 20 20 90 part number, char 18 20 20 20 20 91 module revision code xx xx xx xx 92 test program revision code xx xx xx xx 93 module manufacturing date year xx xx xx xx 94 module manufacturing date week xx xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx xx 99 -127 not used ff ff ff ff table 18 spd codes for hys72d[128/64/32]3xxgbr?6?c (cont?d) product type & organization hys72d128320gbr?6?c hys72d64320gbr?6?c hys72d64300gbr?6?c hys72d32300gbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 38 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 19 spd codes for hys72d[128/64/32]3xxhbr?6?c product type & organization hys72d128320hbr?6?c hys72d64320hbr?6?c hys72d64300hbr?6?c hys72d32300hbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex 0 programmed spd bytes in e2prom 80 80 80 80 1 total number of bytes in e2prom 08 08 08 08 2 memory type (ddr = 07h) 07 07 07 07 3 number of row addresses 0d 0d 0d 0d 4 number of column addresses 0b 0a 0b 0a 5 number of dimm ranks 02 02 01 01 6 data width (lsb) 48 48 48 48 7 data width (msb) 00 00 00 00 8 interface voltage levels 04 04 04 04 9 t ck @ clmax (byte 18) [ns] 60 60 60 60 10 t ac sdram @ clmax (byte 18) [ns] 70 70 70 70 11 error correction support 02 02 02 02 12 refresh rate 82 82 82 82 13 primary sdram width 04 08 04 08 14 error checking sdram width 04 08 04 08 15 t ccd [cycles] 01 01 01 01 16 burst length supported 0e 0e 0e 0e 17 number of banks on sdram device 04 04 04 04 18 cas latency 0c 0c 0c 0c 19 cs latency 01 01 01 01 20 write latency 02 02 02 02 21 dimm attributes 26 26 26 26 22 component attributes c1 c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 75 75 75 75 24 t ac sdram @ clmax -0.5 [ns] 70 70 70 70 25 t ck @ clmax -1 (byte 18) [ns] 00 00 00 00
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 39 rev. 1.2, 2004-10 07302003-2mi6-fop1 26 t ac sdram @ clmax -1 [ns] 00 00 00 00 27 t rpmin [ns] 48 48 48 48 28 t rrdmin [ns] 30 30 30 30 29 t rcdmin [ns] 48 48 48 48 30 t rasmin [ns] 2a 2a 2a 2a 31 module density per rank 80 40 80 40 32 t as , t cs [ns] 75 75 75 75 33 t ah , t ch [ns] 75 75 75 75 34 t ds [ns] 45 45 45 45 35 t dh [ns] 45 45 45 45 36 - 40 not used 00 00 00 00 41 t rcmin [ns] 3c 3c 3c 3c 42 t rfcmin [ns] 48 48 48 48 43 t ckmax [ns] 30 30 30 30 44 t dqsqmax [ns] 28 28 28 28 45 t qhsmax [ns] 50 50 50 50 46 not used 00 00 00 00 47 dimm pcb height 00 00 00 00 48 - 61 not used 00 00 00 00 62 spd revision 00 00 00 00 63 checksum of byte 0-62 49 10 48 0f 64 jedec id code of infineon (1) c1 c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 00 72 module manufacturer location xx xx xx xx 73 part number, char 1 37 37 37 37 74 part number, char 2 32 32 32 32 75 part number, char 3 44 44 44 44 table 19 spd codes for hys72d[128/64/32]3xxhbr?6?c (cont?d) product type & organization hys72d128320hbr?6?c hys72d64320hbr?6?c hys72d64300hbr?6?c hys72d32300hbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 40 rev. 1.2, 2004-10 07302003-2mi6-fop1 76 part number, char 4 31 36 36 33 77 part number, char 5 32 34 34 32 78 part number, char 6 38 33 33 33 79 part number, char 7 33 32 30 30 80 part number, char 8 32 30 30 30 81 part number, char 9 30 48 48 48 82 part number, char 10 48 42 42 42 83 part number, char 11 42 52 52 52 84 part number, char 12 52 36 36 36 85 part number, char 13 36 43 43 43 86 part number, char 14 43 20 20 20 87 part number, char 15 20 20 20 20 88 part number, char 16 20 20 20 20 89 part number, char 17 20 20 20 20 90 part number, char 18 20 20 20 20 91 module revision code xx xx xx xx 92 test program revision code xx xx xx xx 93 module manufacturing date year xx xx xx xx 94 module manufacturing date week xx xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx xx 99 -127 not used ff ff ff ff table 19 spd codes for hys72d[128/64/32]3xxhbr?6?c (cont?d) product type & organization hys72d128320hbr?6?c hys72d64320hbr?6?c hys72d64300hbr?6?c hys72d32300hbr?6?c 1 gbyte 512 mb 512 mb 256 mb 72 72 72 72 2 ranks 2 ranks 1 rank 1 rank label code pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 pc2700r? 25330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 41 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 20 spd codes for hys72d[128/64/32]3xxgbr?7?c product type & organization hys72d128320gbr?7?c hys72d64300gbr?7?c hys72d32300gbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex 0 programmed spd bytes in e2prom 80 80 80 1 total number of bytes in e2prom 08 08 08 2 memory type (ddr = 07h) 07 07 07 3 number of row addresses 0d 0d 0d 4 number of column addresses 0b 0b 0a 5 number of dimm ranks 02 01 01 6 data width (lsb) 48 48 48 7 data width (msb) 00 00 00 8 interface voltage levels 04 04 04 9 t ck @ clmax (byte 18) [ns] 70 70 70 10 t ac sdram @ clmax (byte 18) [ns] 75 75 75 11 error correction support 02 02 02 12 refresh rate 82 82 82 13 primary sdram width 04 04 08 14 error checking sdram width 04 04 08 15 t ccd [cycles] 01 01 01 16 burst length supported 0e 0e 0e 17 number of banks on sdram device 04 04 04 18 cas latency 0c 0c 0c 19 cs latency 01 01 01 20 write latency 02 02 02 21 dimm attributes 26 26 26 22 component attributes c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 75 75 75 24 t ac sdram @ clmax -0.5 [ns] 75 75 75 25 t ck @ clmax -1 (byte 18) [ns] 00 00 00 26 t ac sdram @ clmax -1 [ns] 00 00 00
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 42 rev. 1.2, 2004-10 07302003-2mi6-fop1 27 t rpmin [ns] 50 50 50 28 t rrdmin [ns] 3c 3c 3c 29 t rcdmin [ns] 50 50 50 30 t rasmin [ns] 2d 2d 2d 31 module density per rank 80 80 40 32 t as , t cs [ns] 90 90 90 33 t ah , t ch [ns] 90 90 90 34 t ds [ns] 50 50 50 35 t dh [ns] 50 50 50 36 - 40 not used 00 00 00 41 t rcmin [ns] 41 41 41 42 t rfcmin [ns] 4b 4b 4b 43 t ckmax [ns] 30 30 30 44 t dqsqmax [ns] 32 32 32 45 t qhsmax [ns] 75 75 75 46 not used 00 00 00 47 dimm pcb height 00 00 00 48 -61 not used 00 00 00 62 spd revision 00 00 00 63 checksum of byte 0-62 05 04 cb 64 jedec id code of infineon (1) c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 72 module manufacturer location xx xx xx 73 part number, char 1 37 37 37 74 part number, char 2 32 32 32 75 part number, char 3 44 44 44 76 part number, char 4 31 36 33 77 part number, char 5 32 34 32 table 20 spd codes for hys72d[128/64/32]3xxgbr?7?c (cont?d) product type & organization hys72d128320gbr?7?c hys72d64300gbr?7?c hys72d32300gbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 43 rev. 1.2, 2004-10 07302003-2mi6-fop1 78 part number, char 6 38 33 33 79 part number, char 7 33 30 30 80 part number, char 8 32 30 30 81 part number, char 9 30 47 47 82 part number, char 10 47 42 42 83 part number, char 11 42 52 52 84 part number, char 12 52 37 37 85 part number, char 13 37 43 43 86 part number, char 14 43 20 20 87 part number, char 15 20 20 20 88 part number, char 16 20 20 20 89 part number, char 17 20 20 20 90 part number, char 18 20 20 20 91 module revision code 0x 0x 0x 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx 99 - 127 not used 00 00 00 table 20 spd codes for hys72d[128/64/32]3xxgbr?7?c (cont?d) product type & organization hys72d128320gbr?7?c hys72d64300gbr?7?c hys72d32300gbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 44 rev. 1.2, 2004-10 07302003-2mi6-fop1 table 21 spd codes for hys72d[128/64/32]3xxhbr?7?c product type & organization hys72d128320hbr?7?c hys72d64300hbr?7?c hys72d32300hbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex 0 programmed spd bytes in e2prom 80 80 80 1 total number of bytes in e2prom 08 08 08 2 memory type (ddr = 07h) 07 07 07 3 number of row addresses 0d 0d 0d 4 number of column addresses 0b 0b 0a 5 number of dimm ranks 02 01 01 6 data width (lsb) 48 48 48 7 data width (msb) 00 00 00 8 interface voltage levels 04 04 04 9 t ck @ clmax (byte 18) [ns] 70 70 70 10 t ac sdram @ clmax (byte 18) [ns] 75 75 75 11 error correction support 02 02 02 12 refresh rate 82 82 82 13 primary sdram width 04 04 08 14 error checking sdram width 04 04 08 15 t ccd [cycles] 01 01 01 16 burst length supported 0e 0e 0e 17 number of banks on sdram device 04 04 04 18 cas latency 0c 0c 0c 19 cs latency 01 01 01 20 write latency 02 02 02 21 dimm attributes 26 26 26 22 component attributes c1 c1 c1 23 t ck @ clmax -0.5 (byte 18) [ns] 75 75 75 24 t ac sdram @ clmax -0.5 [ns] 75 75 75 25 t ck @ clmax -1 (byte 18) [ns] 00 00 00 26 t ac sdram @ clmax -1 [ns] 00 00 00
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 45 rev. 1.2, 2004-10 07302003-2mi6-fop1 27 t rpmin [ns] 50 50 50 28 t rrdmin [ns] 3c 3c 3c 29 t rcdmin [ns] 50 50 50 30 t rasmin [ns] 2d 2d 2d 31 module density per rank 80 80 40 32 t as , t cs [ns] 90 90 90 33 t ah , t ch [ns] 90 90 90 34 t ds [ns] 50 50 50 35 t dh [ns] 50 50 50 36 - 40 not used 00 00 00 41 t rcmin [ns] 41 41 41 42 t rfcmin [ns] 4b 4b 4b 43 t ckmax [ns] 30 30 30 44 t dqsqmax [ns] 32 32 32 45 t qhsmax [ns] 75 75 75 46 not used 00 00 00 47 dimm pcb height 00 00 00 48 -61 not used 00 00 00 62 spd revision 00 00 00 63 checksum of byte 0-62 05 04 cb 64 jedec id code of infineon (1) c1 c1 c1 65 - 71 jedec id code of infineon (2 - 8) 00 00 00 72 module manufacturer location xx xx xx 73 part number, char 1 37 37 37 74 part number, char 2 32 32 32 75 part number, char 3 44 44 44 76 part number, char 4 31 36 33 77 part number, char 5 32 34 32 table 21 spd codes for hys72d[128/64/32]3xxhbr?7?c (cont?d) product type & organization hys72d128320hbr?7?c hys72d64300hbr?7?c hys72d32300hbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram spd contents data sheet 46 rev. 1.2, 2004-10 07302003-2mi6-fop1 78 part number, char 6 38 33 33 79 part number, char 7 33 30 30 80 part number, char 8 32 30 30 81 part number, char 9 30 48 48 82 part number, char 10 48 42 42 83 part number, char 11 42 52 52 84 part number, char 12 52 37 37 85 part number, char 13 37 43 43 86 part number, char 14 43 20 20 87 part number, char 15 20 20 20 88 part number, char 16 20 20 20 89 part number, char 17 20 20 20 90 part number, char 18 20 20 20 91 module revision code 0x 0x 0x 92 test program revision code xx xx xx 93 module manufacturing date year xx xx xx 94 module manufacturing date week xx xx xx 95 - 98 module serial number (1 - 4) xx xx xx 99 - 127 not used 00 00 00 table 21 spd codes for hys72d[128/64/32]3xxhbr?7?c (cont?d) product type & organization hys72d128320hbr?7?c hys72d64300hbr?7?c hys72d32300hbr?7?c 1 gbyte 512 mb 256 mb 72 72 72 2ranks 1rank 1rank label code pc2100r?20330 pc2100r?20330 pc2100r?20330 jedec spd revision rev 0.0 rev 0.0 rev 0.0 byte# description hex hex hex
data sheet 47 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram package outlines 6 package outlines 6.1 raw card a figure 6 package outlines ? raw card a hys72d32300[g/h]br?[5/6/7]?c (1 rank 8) l-dimm-184-021 6.35 0.1 2.5 0.1 4 0.1 1 6.62 95 64.77 ?0.1 a bc 1.27 x= 120.65 2.175 a c a b 128.95 133.35 b 49.53 92 28.58 0.13 0.15 b a c 2.64 ma x. 1.27 0.4 c 0.1 0.13 detail of contacts 0.2 1.27 0.2 0.05 1 0.1 a 2.5 93 3.8 c b 17.8 10 184 burr max. 0.4 allowed 3 min. 0.1 1.8 b a 0.1 c
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram package outlines data sheet 48 rev. 1.2, 2004-10 6.2 raw card c figure 7 package outlines ? raw card c hys72d64300[g/h]br?[5/6/7]?c (1 rank 4) l-dimm-184-22-2 128.95 2.5 1 64.77 ?0.1 0.1 a bc 4 0.1 0.1 a 120.65 6.35 1.27 95 x = 2.175 49.53 a c b 133.35 92 b 0.13 28.58 0.15 b a c 0.13 0.05 1 1.27 0.1 ab c detail of contacts 0.2 2.5 0.2 3.8 93 1.8 0.1 c 0.1 ab 17.8 184 10 1.27 0.4 c 0.1 4 max. burr max. 0.4 allowed 3 min. 6.62
data sheet 49 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram package outlines 6.3 raw card b figure 8 package outlines ? raw card b hys72d64320gbr?[5/6]?c (2 ranks 8) l-dimm-184-23 4 max. 1.27 c 0.1 0.4 0.1 ?0.1 0.1 2.5 0.1 4 1 x 95 c 64.77 ab 120.65 1.27 = 2.175 6.35 a b c a 133.35 128.95 49.53 92 0.15 c ab 0.13 b 28.58 b a 0.1 c 1.8 c 1 b 0.1 a detail of contacts 0.2 1.27 3.8 0.13 93 0.2 2.5 0.05 17.8 184 10 0.1 3 min. burr max. 0.4 allowed 6.62
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram package outlines data sheet 50 rev. 1.2, 2004-10 6.4 raw card d figure 9 package outlines ? raw card d hys72d128320[g/h]br?[6/7]?c (2 ranks 4) l-dimm-184-24-3 1 92 93 184 17.8 10 3.8 0.13 3 min. a 0.1 1.8 0.1 c b 0.05 1 1.27 c a 0.1 b 0.2 detail of contacts 2.5 0.2 a 4 0.1 0.1 bc 0.1 2.5 ?0.1 abc 6.62 2.175 1.27 64.77 95 x 120.65 = 6.35 49.53 b 0.13 30.48 128.95 a a 133.35 0.15 a bc 4 max. 1.27 0.4 c 0.1 burr max. 0.4 allowed
data sheet 51 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram application note 7 application note power up and power management on ddr registered dimms (according to jedec ballot jc-42.5 item 1173) 184-pin double data rate (ddr) registered dimms include two new features to facilitate controlled power-up and to minimize power consumption during low power mode. one feature is externally controlled via a system- generated reset signal ; the second is based on m odule detection of the inpu t clocks. these enhancements permit the modules to power up with sdram outputs in a hi gh-z state (eliminating risk of high current dissipations and/or dotted i/os), and result in the powering-down of module support devices (registers and phase-locked loop) when the memory is in self-refresh mode. the new reset pin controls power diss ipation on the module?s registers a nd ensures t hat cke and other sdram inputs are maintained at a va lid ?low? level during powe r-up and self refresh. when reset is at a low level, all the register outputs are forced to a low level, and all differen tial register input receivers are powered down, resulting in very low register po wer consumption. the reset pin, located on dimm tab #10, is driven from the system as an asynchronous signal according to the attached details . using this function also permits the system and dimm clocks to be stopped during memory self refresh operation, while ensuring that the sdrams stay in self refresh mode. as described in the table above, a low on the reset input ensures that the clock enable (cke) signal(s) are maintained low at the sdram pins (cke being one of t he 'q' signals at the register output). holding cke low maintains a high impedance state on the sdram dq, dqs and dm outputs ? wher e they will remain until activated by a valid ?read? cycle. cke low also main tains sdrams in self refr esh mode when applicable. the ddr pll devices automatically detect clock activity above 20mhz. when an input clock frequency of 20mhz or greater is detected, the pll begins operation and initiates clock frequency lock (the minimum operating frequency at which all specif ications will be met is 95mhz). if the cloc k input frequency drop s below 20mhz (actual detect frequency will vary by vendor), the pll vco (voltage controlled oscillator) is stoppe d, outputs are made high-z, and the differential inputs are powered down ? re sulting in a total pll current consumption of less than 1ma. use of this low power pll function makes the use of the pll reset (or g pin) unnecessary, and it is tied inactive on the dimm. this application note describes th e required and optional system sequen ces associated wit h the ddr registered dimm 'reset ' function. it is important to note that all refere nces to cke refer to both cke0 and cke1 for a 2- bank dimm. because reset applies to all dimm r egister devices, it is therefore not possible to uniquely control cke to one physical dimm bank through the us e of the reset pin. table 22 reset truth table register inputs register outputs reset ck ck data in (d) data out (q) h rising falling h h h rising falling l l h l or h l or h x qo h high z high z x illegal input conditions l x or hi-z x or hi-z x or hi-z l x: don?t care, hi-z: hig h impedance, qo: data latched at the previous of ck rising and ck falling
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram application note data sheet 52 rev. 1.2, 2004-10 power-up sequence with reset ? required 1. the system sets reset at a valid low level. this is the preferred default state duri ng power-up. this input condition forces all register outputs to a low state independent of the condition on the r egister inputs (data and clock), ensuri ng that cke is at a stable low-level at the ddr sdrams. 2. the power supplies should be init ialized according to the jedec-appr oved initialization sequence for ddr sdrams. 3. stabilization of clocks to the sdram the system must drive clocks to the application frequency (pll operation is not assured until the input clock reaches 20 mhz). stability of clocks at the sdrams will be affected by all applic able system clock devices, and time must be allotted to permit all clock devices to settle. once a stable clock is received at the dimm pll, the required pll stabilization time (assuming power to the dimm is stable) is 100 microseconds. when a stable clock is present at the sdram input (d riven from the pll), the ddr sdram requires 200 sec prior to sdram operation. 4. the system applies valid logic levels to the data inputs of the register (address and controls at the dimm connector). cke must be maintained low and all other inputs should be driven to a known state. in general these commands can be determined by the system designer . one option is to apply an sdram ?nop? command (with cke low), as this is the firs t command defined by the jedec initia lization sequence (ideally this would be a ?nop deselect? command). a second option is to apply low levels on all of the register inputs to be consistent with the state of the register outputs. 5. the system switches reset to a logic ?high? level. the sdram is now functional and prepared to receiv e commands. since the reset signal is asynchronous, setting the reset timing in relation to a specific clock edge is not required (during this period, register inputs must remain stable). 6. the system must maintain stable register in puts until normal register operation is attained. the registers have an activation time that allows their clock receivers, dat a input receivers, and output drivers sufficient time to be turned on and become stable. duri ng this time the system mu st maintain the valid logic levels described in step 5. it is also a functional requi rement that the registers maintain a low state at the cke outputs to guarantee that the ddr sdrams continue to receive a low level on cke. register activation time ( t (act) ), from asynchro nous switching of reset from low to high until the registers are stable and ready to accept an input signal, is specified in the register and dimm do-umentation. 7. the system can begin the jedec-defined ddr sdram power-up sequence (according to the jedec- pproved initialization sequence). self refresh entry (reset low, clocks powered off) ? optional self refresh can be used to retain data in ddr sdra m dimms even if the rest of the system is powered down and the clocks are off. this mode allows the ddr sdrams on the dimm to retain data without external clocking. self refresh mode is an id eal time to utilize the reset pin, as this can reduce register power consumption (reset low deactivates register ck and ck, data input receivers, and data output drivers). 1. 1. the system applies self refresh entry command. (cke low, cs low, ras low, cas low, we high) note: note: the commands reach the ddr sdram one clock later due to the additional register pipelining on a registered dimm. after this command is issued to the sdram, all of the address and control and clock input conditions to the sdram are don?t cares? with the exception of cke. 2. the system sets reset at a valid low level. this input condition forces all register outputs to a low state, independent of the condition on the registerm inputs (data and clock), and ensures that cke, and all other control and address sign als, are a stable low-level at the ddr sdrams. since the reset signal is asynchronous, setting the reset timing in relation to a specific clock edge is not required. 3. the system turns off clock inputs to the dimm. (optional) a. in order to reduce dimm pll current, the clock input s to the dimm are turned off, resulting in high-z clock
data sheet 53 rev. 1.2, 2004-10 hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram application note inputs to both the sdrams and the registers. this must be done after the reset deactivate time of the register (t (inact) . the deactivate time defines the time in which the clocks and the control and address signals must maintain valid levels after reset low has been applied and is sp ecified in the register and dimm documentation. b.the system may release dimm addres s and control inputs to high-z. this can be done after the reset deactivate time of the register. the deac tivate time defines the time in which the clocks and the control and the address si gnals must maintain va lid levels after reset low has been applied. it is highly recommended that cke continue to remain low during this operation. 4. the dimm is in lowest power self refresh mode. self refresh exit (reset low, clocks powered off) ? optional 1. stabilization of clocks to the sdram. the system must drive clocks to the application frequency (pll operation is not assured until the input clock reaches ~20mhz). stability of clocks at the sdrams will be affected by all applicable syst em clock devices, and time must be allotted to permit all clock devices to settle. once a stable clock is received at the dimm pll, the required pll stabilizat ion time (assuming powe r to the dimm is stab le) is 100 microseconds. 2. the system applies valid logic levels to the data inputs of the register (address and controls at the dimm connector). cke must be maintained low and all other inputs should be driven to a known state. in general these commands can be determined by the system designer . one option is to apply an sdram ?nop? command (with cke low), as this is the firs t command defined by the jedec self refresh exit sequence (ideally this would be a ?nop deselect? command). a second option is to apply low levels on all of the register inputs, to be consistent with the state of the register outputs. 3. the system switches reset to a logic ?high? level. the sdram is now functional and prepared to receiv e commands. since the reset signal is asynchronous, reset timing relationship to a specific clock edge is not required (during this period, register inputs must remain stable). 4. the system must maintain stable register in puts until normal register operation is attained. the registers have an activation time that allows the clock receivers, input rece ivers, and output drivers sufficient time to be turned on and become stable. duri ng this time the system mu st maintain the valid logic levels described in step 2. it is also a functional require ment that the registers main tain a low state at the cke outputs to guarantee that the ddr sdrams continue to receive a low level on cke. register activation time (t (act) ), from asynchronous switching of reset from low to high until the registers are stable and ready to accept an input signal, is specified in the register and dimm do-umentation. 5. system can begin the jedec-defined d dr sdram self refresh exit procedure. self refresh entry (reset low, clocks running) ? optional although keeping the clocks running increases power consum ption from the on-dimm pll during self refresh, this is an alternate operating mode for these dimms. 1. 1. system enters self refresh entry command. (cke low, cs low, ras low, cas low, we high) note: note: the commands reach the ddr sdram one clock later due to the additional register pipelining on a registered dimm. after this command is issued to the sdram, all of the address and control and clock input conditions to the sdram are don?t cares ? with the exception of cke. 2. the system sets reset at a valid low level. this input condition forces all register outputs to a low state, independent of the condition on the data and clock register inputs, and ensures that cke is a stable low-level at the ddr sdrams. 3. the system may release dimm addres s and control inputs to high-z. this can be done after the reset deactivate time of the register (t (inact) ). the deactivate time describes the time in which the clocks and th e control and the address signals must maintain valid levels after reset low has been applied. it is highly recommended that cke continue to remain low during the operation. 4. the dimm is in a low power, self refresh mode.
hys72d[128/64/32]3xx [g/h]br?[5/6/7]?c registered double data rate sdram application note data sheet 54 rev. 1.2, 2004-10 self refresh exit (reset low, clocks running) ? optional 1. the system applies valid logic levels to the data inputs of the register (address and controls at the dimm connector). cke must be maintained low and all other inputs should be driven to a known state. in general these commands can be determined by the system designer. one option is to apply an sdram ?nop? command (with cke low), as this is the first command de fined by the self refresh exit sequence (ideally this would be a ?nop deselect? command). a second option is to apply low levels on all of the register inputs to be consistent with the state of the register outputs. 2. the system switches reset to a logic 'high' level. the sdram is now functional and prepared to receiv e commands. since the reset signal is asynchronous, it does not need to be tied to a particular clock edge (during this period, register inputs must continue to remain stable). 3. the system must maintain stable register in puts until normal register operation is attained. the registers have an activation time that allows the clock receivers, input rece ivers, and output drivers sufficient time to be turned on and become stable. duri ng this time the system mu st maintain the valid logic levels described in step 1. it is also a functional require ment that the registers main tain a low state at the cke outputs in order to guarantee that the ddr sdrams continue to receive a low level on cke. this activation time, from asynchronous switching of reset from low to high, until the registers are stable and ready to accept an input signal, is t (act ) as specifie d in the register and dimm documentation. 4. the system can begin jedec defined ddr sdram self refresh exit procedure. self refresh entry/exit (reset high, clocks running) ? optional as this sequence does not involve the use of the reset function, the jedec stan dard sdram specification explains in detail the method for entering and exiting self refr esh for this case. self refresh entry (reset high, clocks powered off) ? not permissible in order to maintain a valid low level on the register output, it is required that either the clocks be running and the system drive a low level on cke, or the clocks are po wered off and reset is asserted low according to the sequence defined in this application note . in the case where reset remains high and the clocks are powered off, the pll drives a high-z clock input into the register clock input. without the low level on reset an unknown dimm state will result.
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